ADN9A2
COM Express Type 10, Intel® Atom® Processor Alder Lake N Series, LPDDR5, 4 PCIe x1, 2 SATA 3.0, 2 USB 3.2, 8 USB 2.0, 1 LVDS/eDP, 1 DDI, -5 to 65°C
COM Express Mini, AMD® Ryzen™ R1000 Series, LPDDR4, 3 PCIe x1, 2 SATA 3.0, 10 USB, 1 LVDS, 1 DDI
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| Model Name | Part Number | Description |
|---|---|---|
| GH9A3-B40-R15 | 770-GH9A31-000G | AMD® Ryzen™ Embedded R1505G, 4G Memory onboard, DIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Heat Sink, 0 to 60°C |
| GH9A3-T40-R16 | 770-GH9A31-100G | AMD® Ryzen™ Embedded R1606G, 4G Memory onboard, DIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Cooler, -40 to 85°C |
| GH9A3-T80-R16 | 770-GH9A31-200G | AMD® Ryzen™ Embedded R1606G, 8G Memory onboard, SDIO, 1 LVDS, 1 LAN, 2 USB 3.0, 8 USB 2.0, ATX/AT Power, Thermal: Cooler, -40 to 85°C |
| Item Name | Part Number | Description |
|---|---|---|
| COM100-B Carrier Board Kit | 770-COM104-000G | |
| COM335 Carrier Board Kit | 770-CM3351-000G |
Termékadatlap a gyártó oldalánProduct page on the manufacturer's site →
COM Express Type 10, Intel® Atom® Processor Alder Lake N Series, LPDDR5, 4 PCIe x1, 2 SATA 3.0, 2 USB 3.2, 8 USB 2.0, 1 LVDS/eDP, 1 DDI, -5 to 65°C
AL9A2, COM Express Mini with Intel Atom®/Pentium®/Celeron®, designed with Ruggedize, wide temperature, power-saving which is ideal for IoT/automation/transportation/medical applications
AL9A3, COM Express Mini with Intel Atom®/Pentium®/Celeron®, designed with Ruggedize, wide temperature, power-saving which is ideal for IoT/automation/transportation/medical applications
COM Express Type 10, Intel Atom® E3900, LPDDR4, 4 PCIe x1, 2 SATA 3.0, 10 USB, 1 LVDS/eDP, 1 DDI, eMMC 128GB