DFI's ED700-EHL/ED700-EHL22I is the 5G-module support Fanless Embedded System powered by Intel® Atom® Processors X Series. It is ideal for AMR/AGV, machine vision and other industrial automation applications. ED700-EHL supports 5G cellular, 2.5GbE TSN, 3 M.2, 1 VGA, 4 COM, up to 4 LAN or 4 USB 3.1.
A dokumentumok a DFI szerveréről töltődnek le.Documents are served from DFI's own servers.
| Model Name | Part Number | Description |
|---|---|---|
| ED700-EHL | 750-ED70001-000G | Intel® Celeron® J6412, 4GB RAM(OnBoard), 16GB eMMC, 2 USB 2.0, 4 USB 3.1, 1 2.5GbE, 2 GbE, 2 COM, 1 VGA, 0 to 60°C |
| ED700-EHL | 750-ED70001-100G | Intel® Atom® x6413E, 8GB RAM(OnBoard), 32GB eMMC, 2 USB 2.0, 4 USB 3.1, 1 2.5GbE, 2 GbE, 2 COM, 1 VGA, In-Band ECC Support(Default disabled), -40 to 60°C |
| ED700-EHL | 750-ED70001-200G | Intel® Atom® x6425E, 8GB RAM(OnBoard), 32GB eMMC, 2 USB 2.0, 2 USB 3.1, 1 2.5GbE, 3 GbE, 2 COM, 1 VGA, In-Band ECC Support(Default disabled), -40 to 60°C |
| ED700-EHL22I | 750-ED71001-300G | Intel® Celeron® J6412, 4GB RAM(OnBoard), 16GB eMMC, 2 USB 2.0, 4 USB 3.1, 1 2.5GbE, 2 GbE, 2 COM, 2 COM(Isolated), 6 bit DI+ 6 bit DO(Isolated), 1 VGA, 0 to 60°C |
| ED700-EHL22I | 750-ED71001-400G | Intel® Atom® x6425RE, 8GB RAM(OnBoard), 32GB eMMC, 2 USB 2.0, 2 USB 3.1, 1 2.5GbE, 3 GbE, 2 COM, 2 COM(Isolated), 6 bit DI+ 6 bit DO(Isolated), 1 VGA, In-Band ECC Support(Default disabled), -40 to 60°C, Support TCC |
| Item Name | Part Number | Description |
|---|---|---|
| Adapter | 671-106013-000G 671-106012-000G | 60W 12V inlet C14, locable DC Jack 5.5/2.5mm, cable length 1000mm, wide temp. 60W 12V inlet C14, locable DC Jack 5.5/2.5mm, cable length 1500mm |
| Power Cord | 332-700010-201G A81-004003-000G A81-000001-000G A81-000046-000G | Power Cord US 3pin 1830mm Length Power Cord EU 2pin 1830mm Length Power Cord China 3pin 1830mm Length Power Cord JP 3pin 1830mm length (with DFI PSE logo) |
| Din Rail kit | 761-ED70001-000G | ED700-EHL Din rail kit |
Termékadatlap a gyártó oldalánProduct page on the manufacturer's site →
The BMAL box module also supports DFI’s Adaptive Display Platform (ADP) Technology. It is an innovative panel PC solution that offers the flexibility of modularized integration of panel PC components for expedited product development and shortened time to market.
EB100-KU, Fanless Embedded System with 6th/7th Gen Intel® i3/i5/i7 or Celeron®, designed with powerful and NUC-sized which is ideal for Infrared Inspection/Digital Signage/IoT Gateway applications
Industrial NUC compact system, Intel Core Ultra Processor, 1 DDR5 SODIMM, 2 HDMI, up to 2 LAN, 4 USB, 2 COM, 2 USB-C
Fanless Embedded System, Intel® Processor N-series/Atom® Processor X Series, On Board OOB built-in, 2.5 GbE, DDR5, VGA/HDMI/USB-C
